product_menu_101.gif

product_menu_1001.gif

product_menu_1101.gif

product_menu_1201.gif

product_menu_1401.gif

product_menu_1102.gif

 





 

Purpose

MLCC molding, film drying and curing

Specification

Film width (150 ~ 500m/m)

Length

4,000 ~ 9,000m/m

TEMP

250℃
 
 

The equpiment used to dry coated and molded print in semiconductorproduction process by using film

 
 

Explosion-proof structured, safe drying the products such as Talrugen, thinner, solvent, products with risk of fire

Equipped with HEPA FILTER and MEDIUH FILTER, removes more than 99.97% of airborne fine dust.

Temperature difference - 3 different ZONE, each ZONE can be adjusted up and down with AIR NOZZEL, and each NOZZEL can vary air flow

Key features - gas sensor, displacement meter, nozzle pressure anemometer, power P.I.D. control using S.C.R