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MLCC molding, film drying and curing |
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Film width (150 ~ 500m/m) |
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4,000 ~ 9,000m/m |
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250℃ |
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The equpiment used to dry coated and molded print in semiconductorproduction process by using film |
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Explosion-proof structured, safe drying the products such as Talrugen, thinner, solvent, products with risk of fire |
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Equipped with HEPA FILTER and MEDIUH FILTER, removes more than 99.97% of airborne fine dust.
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Temperature difference - 3 different ZONE, each ZONE can be adjusted up and down with AIR NOZZEL, and each NOZZEL can vary air flow |
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Key features - gas sensor, displacement meter, nozzle pressure anemometer, power P.I.D. control using S.C.R
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